Laser Laser Advantages:

The text and pattern information on the chip has its corresponding representative meaning, which is convenient for later identification and tracking. However, the chip is characterized by small size, high requirements on marking position accuracy, and can not destroy the functional properties of the chip, so laser marking is a better choice.

Laser marking is one of the most commonly used laser processing technologies. According to the laser type, it can be divided into fiber laser marking machine, CO2 laser marking machine, semiconductor laser marking machine, etc. The principle is to locally irradiate the workpiece with a high-energy-density laser to vaporize or change the color of the surface material, thereby leaving a lasting, clear and indelible mark.

With the advancement of technology, handheld laser marking machines and portable laser marking machines that are smaller and more portable; online laser marking machines that can be integrated into production lines; 3D laser marking machines that can be applied to curved surface marking; The PCB laser marking machine designed for PCB circuit board marking has emerged as the times require.

The text and pattern information on the chip has its corresponding representative meaning, which is convenient for later identification and tracking. However, the chip is characterized by small size, high requirements on marking position accuracy, and can not destroy the functional properties of the chip, so laser marking is a better choice.

Laser marking conditions:

 (1) Confirm the selection of laser to meet the requirements of workpiece quality and appearance.
 (2) Design the overall mechanical structure of the IC laser automatic marking system.
 (3) Guarantee IC chip laser automatic marking accuracy.
 (4) Joint debugging and trial operation of the completed IC chip laser automatic marking system.

Choose core record micro laser marking:

1. Reduce replacement costs and improve efficiency.
2. The fixture can be replaced quickly, realizing flexible production of various types and small batches of IC chips.
3. Realize the high accuracy and high speed requirements of IC chip laser marking.
4. Integrate laser, image processing system and motion control system operation.
5. For different IC chip products, optimize the control parameters to meet the equipment design requirements and IC chip laser marking pork belly requirements.
6. Due to the small area of the IC and the high requirements on the accuracy of the marking position (less than 0.05mm), laser marking is suitable.
7. Combined with the design of the electromechanical system, it can realize the flexible production of multi-variety and small batch of IC marking.